HOT SALE USB 2.0 maoto a kobehileng 3 layers port Setulo sa basali se nang le shrapnel

Tlhaloso e Khutšoanyane:

Tlhaloso ea Sehlahisoa

Lebitso la ntho: USB 2.0 maoto a kobehileng 3 layers port

Boemo: DC 30V 0.2A

Insulation resistance: ≥1000mΩ min.500V DC

Matla a dielectric: 250V AC bakeng sa 1 min

Khokahano ea ho ikopanya: ≤50mΩ

Matla a ho kenya: ≤35N

Matla a ho ntša: ≥10N

Tšebeliso:

- E sebelisoa haholo indastering ea maemo a holimo, joalo ka lihlahisoa tsa kh'amera ea dijithale, lisebelisoa tsa khomphutha, lintho tsa ho bapala tsa elektroniki, sehokelo sa ho tjhaja mohala le lihlahisoa tse ling li hloka ho tjhaja.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Melemo ea sehlahisoa: ho tsamaisoa ka potlako, lisampole tsa mahala, lihlahisoa tse nang le setifikeiti sa RoHS, ts'ebetso ea laser soldering, bophelo ba potoloho ea makhetlo a fetang 300,000, ts'ebeletso e netefalitsoeng ka mor'a thekiso, tšehetso ea tekheniki le moea o motle oa ts'ebeletso.
Libaka tsa kopo: Kou ea kantle ea komporo ea USB, lisebelisoa tsa ho tjhaja, lisebelisoa le lisebelisoa, lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa lapeng, lihlahisoa tsa ts'ireletso.
Matla a fektheri: ka lilemo tse 13 tsa boiphihlelo ba indasteri, k'hamphani e fetisitse setifikeiti sa ISO9001, litifikeiti tse ngata tsa patent, bareki ba tšebelisano-mmoho ba fetang 5300, bareki ba bangata ba lik'hamphani tse thathamisitsoeng, basebetsi ba 106, litebele tse 12 tsa Hardware, metjhini e 18 ea ente, 26 e felletseng- Mechini e kopanyang e iketsang, metjhini e 32 ea ho itlhahloba ka botlalo, mechini e 21 ea tlhahlobo ea semi-automatic, metjhini e 12 ea tlhahlobo ea bophelo le lisebelisoa tse ling tse 25.
LINTLHA TSEO:
1. LITŠOANTŠISO:
1.1 NTLO:PA6T+30% G/F,MOLA:BLACK,UL94V-0;
1.2 MAIKUTLO:PHOSPHOR BORONZE
1.3 SHELL:PHOSPHOR BRONZE KAPA SK7
1.4 E IKOMELLA:PHOSPHOR BRONZE KAPA SK7
1.5 SHELI EA KAMORA:SPCC
2. QETELA:
2.1 KOPANANA:
KHAUTA(SHEBA TAFOLE) E TLATSE SEBAKA SA TŠEBELETSO.
100u” MIN.KHANYA-TIN PLATING KA SOLDER TAIL
AREA, 50u” MIN.NICKEL E HLAHALA KA KAKARETSO,
2.2 SHELL:
100u” MIN.NICKEL UNDERPLATNG.
2.3 E IKHETHENG:SHELL: 100u” MIN.NICKEL PLATE
2.4 SHELI EA KA HARA:100u” MIN.NICKEL PLATE.
3. LITŠOANTŠISO TSA MOHLASE:
RATING HONA JOALE: 0.5Amper Maximum
MOSEBETSI: 30V AC.
TŠEBELETSO EA KHOPO :FORCE:0.7KGF BONYENYANE
Khanyetso EA HO: 30 MILLIOHMS MAXIMUM.
INSUULATION REISTANCE: I000MEGOHMS BONYENYANE.
DIELECTRIC HO HLOMELA VOLTAGE: 750V AC AT SEELEVEL.
TŠEBELETSO EA MOCHESO: -55℃~85℃.
MAEMO A MAEMO A ASEPATIMO: NTLE HO HLAKILE HO HLAKILE KA MANGOLO OA MAEMO A MAEMO A MOSEBETSI A HO ETSA LITEKELO LE LITEKO KE TSE LATELANG:
(1) PAKENG TSA MMELE LE KONDUKTA: 5ºC HO 35℃
(2) PAKENG TSA LI-CONDUCTOR TSE SE KE UA KHOTSOA: 45% HO 85%
(3) KHATELLO:86Kpa HO 106Kpa
TEKO YA BILITY TSA SOLDERA: TLHOKOMELO YA DITERMINAL E TLA KENA 1mm KA BATHENG YA LESOLE YA 250±5℃ KA METSOTSO E 5±0.5.
HO HLOKOLA TEKO EA MOCHESO OA SOLDERING:
REFLOW MAEMO A HO SOLIA:
TLHOKOMELISO: MOCHECHE OA SEBAKA SA KOPO O TLA FIHLELA 180 .120 ℃ S KA MOR'A HA PCB E KENA KA MOSEBETSI OA SOLDERING.
MOCHECHE OA BOLELE KA HO FETISISA: MOCHECHE OA BOIKAPENG BA LEFUBA LA KOPO O LOKELA HO FIHLELA TŠEBELETSO E TENG EA HLOHO EA 260±5 KA METSOTSO E 20.℃
MOKHOA OA TŠEPE EA HO TLOSOA: BIT TEMPERATURE 330±5℃ NAKO EA KOPO EA HO SOLDERIRON3±0.5 SEC LE HOJA KHATELLO E EKETSEHILENG E KE KE EA SEBEDISWA TERMINAL.