HOT SALE USB 90 degree interface plug sehokedi 19.5MM iron USB AF side polaka basedi ba USB SMT sehokelo se otlolohileng bakeng sa laptop
Melemo ea sehlahisoa: ho tsamaisoa ka potlako, lisampole tsa mahala, lihlahisoa tse nang le setifikeiti sa RoHS, ts'ebetso ea laser soldering, bophelo ba potoloho ea makhetlo a fetang 300,000, ts'ebeletso e netefalitsoeng ka mor'a thekiso, tšehetso ea tekheniki le moea o motle oa ts'ebeletso.
Libaka tsa kopo: Kou ea kantle ea komporo ea USB, lisebelisoa tsa ho tjhaja, lisebelisoa le lisebelisoa, lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa lapeng, lihlahisoa tsa ts'ireletso.
Matla a fektheri: ka lilemo tse 13 tsa boiphihlelo ba indasteri, k'hamphani e fetisitse setifikeiti sa ISO9001, litifikeiti tse ngata tsa patent, bareki ba tšebelisano-'moho ba fetang 5300, bareki ba bangata ba lik'hamphani tse thathamisitsoeng, basebetsi ba 106, litebele tse 12 tsa Hardware, metjhini e 18 ea ho bopa, 26 e felletseng- Mechini e ikopantseng, metjhini e 32 e itlhahlobang ka botlalo, metjhini e 21 ea tlhahlobo ea semi-automatic, metjhini e 12 ea tlhahlobo ea bophelo le lisebelisoa tse ling tse 25.
LINTLHA TSEO:
1.Tlhaloso ea Boitsebiso:
1)INSULATION MATERIAL THERMOPLASTIC.
2)SHEL: Alloy ea koporo/SPCC,T:0.30mm
TLHOKOMELISO: NICKEL
3) TERMINAL: KOPPER ALLOY,T:0.25mm
HO PALA: KHAUTA/TIN E PHATETSENG.
2. TLHALOSO EA MOHLASE:
1)INSUlation RESISTANCE:100MΩ MIN.
2)KGANYO YA KHOTSO:30mΩ MAX.
3) HO HLOKOMELA MOSEBETSI: 500V AC.
3. LITŠOANTŠISO TSA MEHLENG:
1) MATLA A PHAHAMANG:3.57Kgf MAX.
2)MATLA A HLAHANG:1.02Kgf MIN.
TAELO TSEBISO
Sebaka sa polokelo: tikoloho ea mocheso oa kamore e omileng, qoba ho kopana le asiti le boemo ba leholimo bo mongobo
MAEMO A MAEMO A ASEPATIMO: NTLE HO HLAKILE HO HLAKILE KA MANGOLO OA MAEMO A MAEMO A MOSEBETSI A HO ETSA LITEKELO LE LITEKO KE TSE LATELANG:
(1) PAKENG TSA MMELE LE KONDUKTA: 5ºC HO 35℃
(2) PAKENG TSA LI-CONDUCTOR TSE SE KE UA KHOTSOA: 45% HO 85%
(3) KHATELLO:86Kpa HO 106Kpa
TEKO YA BILITY TSA SOLDERA: TLHOKOMELO YA DITERMINAL E TLA KENA 1mm KA BATHENG YA LESOLE YA 250±5℃ KA METSOTSO E 5±0.5.
HO HLOKOLA TEKO EA MOCHESO OA SOLDERING:
REFLOW MAEMO A HO SOLIA:
TLHOKOMELISO: MOCHECHE OA SEBAKA SA KOPO O TLA FIHLELA 180 .120 ℃ S KA MOR'A HA PCB E KENA KA MOSEBETSI OA SOLDERING.
MOCHECHE OA BOLELE KA HO FETISISA: MOCHECHE OA BOIKAPENG BA LEFUBA LA KOPO O LOKELA HO FIHLELA TŠEBELETSO E TENG EA HLOHO EA 260±5 KA METSOTSO E 20.℃
MOKHOA OA TŠEPE EA HO TLOSOA: BIT TEMPERATURE 330±5℃ NAKO EA KOPO EA HO SOLDERIRON3±0.5 SEC LE HOJA KHATELLO E EKETSEHILENG E KE KE EA SEBEDISWA TERMINAL.